Title: Physical Simulation of Soft Magnetic Composite Impeder Performance for use in Induction Tube Welding Systems
Authors: Muyskens, Sean Michael
Goldstein, Robert Charles
Citation: Proceeding of UIE 2021: XIX International UIE Congress on Evolution and New Trends in Electrothermal Processes. 1.-3.2021, Pilsen, Faculty of Electrical Engineering, University of West Bohemia, Czech Republic, 2021, p. 29-30.
Issue Date: 2021
Publisher: Faculty of Electrical Engineering, University of West Bohemia
Document type: konferenční příspěvek
conferenceObject
URI: http://hdl.handle.net/11025/45773
ISBN: 978-80-261-0930-3
Keywords: svařování indukčních trubek;měkké magnetické kompozity;indukční ohřev;magnetotermické vlastnosti materiálů
Keywords in different language: induction tube welding;soft magnetic composites;induction heating;magnetothermal properties of materials
Abstract in different language: Induction tube welding is used for the continuous production of metallic tubes. These systems often utilize an internal magnetic flux controller (impeder) to improve process efficiency. Significant energy savings and increased productivity have been demonstrated both theoretically and practically when switching from the traditional ferrite impeder core, to one made of a soft magnetic composite (SMC) with high saturation flux density. In order to use SMCs in these systems it is important to balance the greater heat generated in these materials at higher fields with the cooling water available. A test stand was devised for physical simulation of SMC impeder performance for use in induction tube welding systems. Tests were run to determine the loading and cooling conditions that an impeder core made of SMCs could survive. Additionally, loss estimates based on the rise in temperature from the cooling water were compared with published loss data for the SMCs used. The goal of these tests was to create a design envelope in which impeder cores made of SMCs could survive and validate their use in induction tube welding systems.
Rights: © IEEE
Appears in Collections:UIE 2021
UIE 2021

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