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Results 1-10 of 11 (Search time: 0.004 seconds).
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Issue DateTitleAuthor(s)
2018Vlastnosti vícevrstvých TPC strukturHlína, Jiří; Řeboun, Jan; Hamáček, Aleš
2016Adheze a pájitelnost TPC substrátů v závislosti na koncentraci kyslíku ve vypalovacím procesuHlína, Jiří; Řeboun, Jan; Hamáček, Aleš
2019Properties of thick printed copper films on alumina substratesHlína, Jiří; Řeboun, Jan; Hamáček, Aleš
2019Temperature distribution optimization of multichannel sensor system for thermal testing of protective glovesKalaš, David; Šíma, Karel; Pretl, Silvan; Řeboun, Jan; Soukup, Radek; Hamáček, Aleš
2019Advanced application capabilities of thick printed copper technologyHlína, Jiří; Řeboun, Jan; Johan, Jan; Hamáček, Aleš
2020Contacting of SMD components on the textile substratesKalaš, David; Suchý, Stanislav; Kalčík, Jan; Řeboun, Jan; Soukup, Radek; Hamáček, Aleš
2020Copper-filled vias made by thick printed copper technologyHlína, Jiří; Řeboun, Jan; Michal, David; Hamáček, Aleš
2022Behaviour of printed resistors compatible with thick film copper technologyHlína, Jiří; Řeboun, Jan; Hamáček, Aleš
2021Stretch testing of SMD resistors contacted by a novel thermo-compression method on a textile ribbonKalaš, David; Kalčík, Jan; Řeboun, Jan; Soukup, Radek; Hamáček, Aleš
2021Washing resistance of textile ribbon dismountable interconnections in smart textilesŠíma, Karel; Řeboun, Jan; Moravcová, Daniela; Švecová, Lucie; Kalaš, David; Soukup, Radek; Hamáček, Aleš
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